Aerospace

CHIN NAN’s SMP to SMP (In-Series) adapters provide a miniaturized solution engineered for extreme high-frequency mmWave transmission and high-density assembly. Reliably supporting an exceptional 40 GHz bandwidth, this series features unique push-pull and blind-mate capabilities to conquer severely space-constrained board-to-board connections. Its rugged vibration resistance ensures ultimate signal integrity for aerospace, military, high-end medical, and microwave measurement systems.

Key Features

• Extreme mmWave Performance: Reliably spans up to 40 GHz to meet the ultra-high-speed data transmission demands of 5G, satellite, and precision mmWave components.
• Efficient Blind-Mate & Push-Pull: Tool-less push-pull connectivity and superior blind-mate guidance drastically reduce assembly time in complex modular systems.
• High-Density Integration: The ultra-miniaturized footprint significantly minimizes PCB real estate, acting as a critical component for modern micro-device miniaturization.
• Rugged Vibration Resistance: Military-grade mechanical retention and shock resistance guarantee uninterrupted, zero-attenuation signals in highly dynamic environments.
• Low VSWR & High Purity: Precision internal impedance matching maintains Low VSWR and minimal insertion loss to safeguard microwave signal purity.