High-Purity Material Engineering: Eradicating Passive Intermodulation (PIM) Interference Caused by "Trace Impurities" in RF Systems
During the development of 5G/6G high-power base stations or precision medical imaging equipment (MRI), engineers often face a daunting challenge: even when an RF connector's geometric design and dimensions are virtually flawless, the system's overall Passive Intermodulation (PIM) levels can spike abnormally, potentially triggering a costly crisis of product returns.
Such issues rarely stem from design flaws. Rather, they originate from trace impurities within the metal substrate or electromagnetic interference caused by a magnetic nickel underplating. According to the "Skin Effect" principle, high-frequency signals travel only along a microscopically thin layer on the conductor's surface. Consequently, the absolute purity of the material composition directly dictates the clarity of the signal.
