Industrial

CHIN NAN’s 1.0/2.3 series is a precision solution engineered for high-density packaging and high-speed data transmission in telecommunications. Featuring a unique Push-Pull coupling mechanism, it drastically reduces installation space while ensuring secure, quick-disconnect mating without accidental unplugging in dense module arrays. Operating reliably from DC to 4 GHz, it delivers exceptional signal integrity as a critical miniaturization component for modern base stations, switches, and video processors.

Key Features

• Push-Pull Coupling: Combines quick-mating convenience with secure locking, enabling effortless operation and preventing vibration detachment on dense panels.
• High-Density Packaging: The compact design saves over 40% more PCB space than standard BNCs, perfectly accommodating modular equipment demands.
• High Data Rate Support: Reliably supports DC to 4 GHz bandwidth, meeting the rigorous transmission standards of encoders and HD video processors.
• Precise Impedance Matching: Strict 50 Ω control ensures low reflection and minimal loss across filters and wireless components.
• Versatile Integration: Available in crimp and solder options, widely utilized in datacom switches, wireless base stations, and high-end microwave assemblies.